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FEATURES
Very lower Z-CTE
Low water absorption
Excellent thermal reliability
Anti-CAF Capability
APPLICATIONS
Automotive,like ECU,BMS,MCU,VCU
Power suppliers
Back panel,Network and other Multilayer PCB
Industrial
GENERAL PROPERTIES
Item | IPC-TM-650 | Test Condition | Typical value | ||
Glass transition temp. | DSC | ℃ | 185 | ||
CTE,Z-axis | 2.4.24 | α1，TMA | ppm/℃ | 35 | |
α2，TMA | ppm/℃ | 184 | |||
50~260℃，TMA | % | 2 | |||
Decomposition Temp. | 2.4.24.6 | TGA | ℃ | 360 | |
T288 | 2.4.24.1 | TMA,copper clad | min | 30 | |
Thermal stress | 2.4.13.1 | Copper clad | sec | >120 | |
unclad | sec | >180 | |||
Water absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
Peel Strength/18μm | 2.4.8 | as received | lb/in | 6.5 | |
after thermal stress | lb/in | 6.5 | |||
Permittivity(RC50%) | 2.5.5.9 | C-24/23/50,1G | / | 4.4 | |
Loss tagent(RC50%) | 2.5.5.9 | C-24/23/50,1G | / | 0.016 | |
Volume resistivity | 2.5.17.1 | C-96/35/90 | MΩ·cm | 3.20*108 | |
Surface resistivity | 2.5.17.1 | C-96/35/90 | MΩ | 9.80*107 | |
Arc Resistance | 2.5.1 | sec | 122 | ||
Dielectric Breakdown | 2.5.6 | D48/50+D0.5/23 | kV | 58 | |
Flexural strength | Warp | 2.4.4 | as received | MPa | 565 |
Fill | 2.4.4 | as received | MPa | 455 | |
Flame resistance | UL-94 | A&E-24/125 | / | V0 | |
CTI | C-96/20/65 | IEC-60112 | Rating | PLC3 | |
u Specification sheet:IPC-4101/126/101/99/98, for reference only.
u Above typical value is tasted from CCL1.0mm 7628*5,except Dk/Df,the typical value is only for reference，cannot be used as the basis for judgement.